Flex Fabrication

Flex Circuit Manufacturing Process

This is where the magic happens! After taking the time to compose the perfect flex circuit design through the use of concurrent engineering, our team uses cutting-edge tools and technology to bring the drawing board to life. Each custom flex circuit is meticulously manufactured and assembled to meet the stringent criteria required by the client’s application, as well as the design standards for flex and rigid-flex circuits set by IPC 2223 and the qualification and performance specifications for flex and rigid-flex circuits set by IPC 6013.

Concurrent engineering is the key to successful flex fabrication. It allows us to clearly identify our client’s needs, develop a framework for success, and integrate our existing processes with our newfound knowledge to optimize the workflow management. We couldn’t achieve a smooth flex circuit manufacturing process by any other means! In fact, it’s the reason why Flexible Circuits, Inc. has been an industry leader in flex circuit manufacturing since 1963.

Whether you’re looking for flex or rigid-flex circuits, single-sided or multi-layered printed circuit boards, Flexible Circuits, Inc. is your one-stop-shop for custom-made products. Contact us today to get started.

Whether you’re looking for flex or rigid-flex circuits, single-sided or multi-layered printed circuit boards, Flexible Circuits, Inc. is your one-stop-shop for custom-made products. Contact us today to get started.

Learn more about the flex circuit manufacturing process below or contact a Flexible Circuits, Inc. representative to see how we can help boost your applications’ performance to never-before-seen heights.

Signal Integrity

Designing flexible circuits with ideal signal integrity is no easy feat, but the veteran engineers at Flexible Circuits, Inc. continuously produce groundbreaking designs that seek to eliminate many signal integrity challenges. We target the following factors to reduce or altogether eliminate signal interferences.

Our flexible circuits seamlessly integrate into your applications and deliver flawless performance even under stressful conditions, such as high-frequency and high-speed environments.

High Layer Count

Historically, high layer count flexible circuits are infamous for producing an array of technical challenges that have forced even the brightest minds to return back to the drawing board time and again. The beauty of the flexible circuit lies in its lightweight and compact design, which delivers the necessary power without the extra weight. Stacking more and more layers upon a flexible circuit increases the system’s complexity and depreciates its flexibility. It takes a talented group of individuals to assemble a high layer count flexible circuit without sacrificing flexibility or performance.

The Flexible Circuits, Inc. team has over 55 years of experience working with high layer count flexible circuits.

We understand what it takes to produce the best-in-class high-density ruggedized electrical solutions that yield fantastic results when paired with your application. Let’s find out which customer circuit size and shapes would best suit your electrical engineering project.

Minimum Bend Radius

Although flexible circuits were pioneered to eliminate the shortcomings of traditional rigid printed circuit boards, these innovative devices have their own guidelines and regulations, one of them being the minimum bend radius. Simply put, this is the minimum angle at which the flex board can bend. The minimum bend radius plays a huge role in reducing the risk of damage and it is a key performance indicator.

We strongly recommend evaluating the minimum bend radius of your flexible circuit before we enter the assembly process.

Trusted by Industry Leaders

Don’t Wait Around… Choose Us For a Quick Turnaround on Flex Circuits

We deliver high-performance, high-reliability flex circuits that work the first time, every time, and we do so quickly through concurrent engineering. The ability to conduct open and honest discussions with our clients about their needs is of vital importance to stay on schedule and provide cost-effective solutions. With Flexible Circuits, Inc. by your side, your applications will be ready for field operation before you know it!

High-Speed Circuits = High-Performance Applications

Slow is not part of our vocabulary at Flexible Circuits, Inc. Everything we do has a purpose, and that purpose drives us to work day and night in manufacturing the ideal flexible circuit board for your applications.

Through concurrent engineering, we work closely with our clients to assist the design and redesign of the initial layout and scheme until we are confident that we have developed a high-speed flex circuit perfectly suited for your needs. When it comes to maintaining and/or improving the integrity of electrical signals to deliver powerful results, our team of engineers is always up to the challenge. We are constantly innovating behind the scenes to determine which physical characteristics of the flexible printed circuit boards can eliminate problems such as delays, emissions, crosstalk, attenuation, and more. Even one millimeter can make a difference in the speed of the signal, so our engineers have to meticulously manipulate flex circuit components and control the controlled impedance to achieve the desired results.

HDI Circuit Boards

One of the fastest-growing technologies in the market can be yours today!

High Density Interconnect (HDI) circuit boards occupy a higher density of interconnection per unit area when compared to traditional flex circuits. By juxtaposing components closer together, we can significantly reduce the board size to create a smaller, lighter flex circuit. HDI circuit boards have a major impact on performance in applications where space and weight are primary concerns. Additionally, HDI circuit boards provide better signal integrity and higher reliability. These versatile devices are perfectly suited for a wide range of applications in the military and in aerospace.

High Temperature Solutions

New technology comes with new requirements that push the limits of existing materials. Flexible Circuits Inc. is pleased to offer new solutions to your high temperature flexible and rigid-flex applications.

High temperature applications:

  • 225 C service temperature
  • Flame retardant (UL 94V-0)
  • Meets the requirements of IPC-4203/24
  • Can be used with used as all flexible stack-up or combined for use within a rigid-flex

Cut back Coverlay/Bondply:

Because the HT bonding film is an all polyimide construction, the glass transition temperature of the material is very close than the Pyralux AP copper clad material and therefore does not present a reliability issue to be present in the area of the plated through holes.


Additional benefits:

  • Higher reliability (No material transition from flexible to rigid sections. The circuitry is continuously insulated)
  • More usable area of the board (vias can be routed closer to the transition zone).
  • Increased flexibility due to thinner insulating films.

Space Applications:

Along with the exceptional thermal reliability properties of the HT bonding film, the material has also been tested to meet NASA requirements SP-R-0022.

Signal Integrity:


Because the HT bonding film is a full polyimide construction it has a dielectric constant equal to that of the AP copper clads.

High Speed/Low Loss applications:

The flexible circuit market has been lacking a material with the electrical performance properties of PTFE based laminate systems but without the processing needs and concerns. The Dupont HT bondply has similar performance the PTFE base TK system up to 10 GHz.

High Temperature Connectors

Flexible Circuits, Inc. has partnered with TE Connectivity and have created a connector for use in High Temperature application based on the Deutsch 980 series connectors. For reliability purposes, the initial design was created using a compliant pin.

Flexible Circuits Is currently evaluating high temperature potting compounds and thermal blankets for use in a solder pin style connector applications. Contact us for more information.

Figure 2: Insertion loss of Flexible materials

All Your FAQs About the Flex Circuit Manufacturing Process Answered Here!

Each flex circuit design is a custom application with its own characteristics and technical requirements. The basic manufacturing process (print → etch → lamination → drill → plating → rout/profile) is the same for every flex circuit, however, each design must meet its own specialized requirements during the manufacturing process.

Concurrent engineering is the key to a successful relationship. The up-front dialogue between our engineering staff and the client’s engineering staff is absolutely pivotal in achieving a smooth and cost-effective process when producing a robust solution to their flexible interconnection needs.

Flexible Circuits, Inc. has been in business for over 57 years! We developed a laser focus on producing flexible circuitry for the military and aerospace industries since day one, which has enabled us to create and maintain long-lasting relationships with major defense contractors. With an average tenure of 15+ years for our manufacturing associates and over 25 years for our management team, Flexible Circuits, Inc. is fully entrenched in this marketplace. We understand, in the greatest detail, what it takes and how to produce flex and rigid-flex circuit assemblies to meet the most stringent requirements set by the military and aerospace industries.

For any other questions about our concurrent engineering and fabrication processes, standardizations, or certifications, contact us today.

Let's Talk about your flexible circuit needs